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ODVA publishes CompoNet specification

15 March, 2007

The ODVA (formerly the Open DeviceNet Vendors` Association) has published the first edition of its specification for CompoNet – the device-level network designed to provide high-speed communications for large numbers of simple sensors and actuators on small, high-speed machines.

"CompoNet will provide users with a network that is easy to configure and maintain, with comprehensive built-in error detection functions," says ODVA executive director, Katherine Voss. "Whenever large numbers of sensors and actuators are involved, wiring becomes a major cost. CompoNet offers quick and easy installation using a cost-effective flat network cable with pressure-clamping IDC connectors, or round cable."

Componet connector

The cables allow for flexible topologies, including daisy-chain and trunk-line. There is also an option for power (5A at 24V DC) to be carried by the same cable as the signals, and the ability to remove and replace nodes under power.

The Japanese automation industry appears to be particularly keen on CompoNet, with Omron announcing compatible products even before the ODVA published its specification.

"The Japanese market has been longing for a high-speed sensor and actuator network that incorporates advanced configuration and diagnostic capabilities," explains Hiroyuki Usui, who chairs the ODVA’s Japanese group. "CompoNet will meet this need and is expected to gain rapid widespread adoption." He predicts that CompoNet will become the de facto standard for sensor and actuator networks in Japan, where its sibling network, DeviceNet, is already the leading fieldbus technology.




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