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Automation giants back device integration scheme

14 December, 2009

A group of leading automation organisations and suppliers have decided to expand the scope of the EDDL Co-operation Team to accelerate the deployment of FDI (Field Device Integration) technology. A new team called FDI Co-operation will take over the work of harmonising the EDDL and FDT/DTM technologies, which began in 2007 and is now expected to result in a final FDI specification by mid-2010.

The organisations backing the move  include the FDT Group, the Profibus Users Association, the Fieldbus Foundation and the OPC Foundation. The companies involved include ABB, Emerson, Honeywell, Invensys, Siemens and Yokogawa.

The enlarged team, which will also develop design and test tools, aims to produce a system that will allow devices to be integrated across all host systems, devices and protocols that users might need.

Anton Huber, chief executive of Siemens’ automation division, sees the development as “a milestone in achieving an industry-wide harmonisation of device integration as, for the first time, a significant number of vendors have come together to agree on such a standard”. He adds that Siemens will support the FDI technology in its products as soon as it is available.

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