High‑speed hyperspectral inspection camera overcomes sorting barriers
18 May 2026 
Teledyne Dalsa has announced a “groundbreaking” short‑wave infrared (SWIR) hyperspectral camera that, it says, redefines the cost-to-performance ratio for this type of inspection. The Kaleido camera has been designed to overcome the integration and performance barriers of industrial sorting, improving material discrimination and increasing throughput “significantly”.
The camera delivers a spatial resolution of up to 1,280 pixel and line rates exceeding 2.3kHz, allowing more items to be inspected in less time, without sacrificing spectral precision.
The camera, which integrates a sensor, spectrograph and interface, is aimed at critical applications in recycling, food safety, pharmaceuticals and waste management. Built‑in spectral band selection and spectrograph‑based aberration correction simplify its use, ensuring consistent calibration across the operating temperature range.
These innovations are claimed to accelerate time-to-market for machine-builders. Teledyne has integrated proven functions from its linescan products, such as metadata tagging and multiple regions of interest, ensuring that only the most relevant data is delivered to the processing engine.
The camera has a 10 GigE interface that complies with the GigE Vision and GenICam standards. Its sensor maintains strong signal integrity even in low‑light conditions, allowing energy-efficient SWIR LED lighting to be used.
The camera is less than 300mm long including a lens, and has a cross-section of 100 x 120mm.
The camera “combines deep sensor physics, advanced optical design, and world-class system engineering to reduce the complexity and cost of hyperspectral deployment,” says Sadiq Panjwani, senior executive vice-president and general manager of Teledyne Dalsa’s machine vision cameras group. “Kaleido is a scalable solution that improves global outcomes by ensuring food safety, driving cleaner manufacturing, and enabling more responsible resource management. This is the future of industrial intelligence.”
