♦  The Sercos organisation has announced the development a packaging profile for real-time Ethernet-based Sercos III. The Pack Profile defines a subset of Sercos interface functions for packaging machinery, and will improve multi-vendor interoperability of servo controls and drives. Conforming products will provide plug-and-play functions. The profile will be available in April 2009.

♦  ODVA has published new editions of the specifications for the CIP network family (EtherNet/IP, DeviceNet, CompoNet, ControlNet and CIP Safety). There are 20 enhancements to the specifications. For example, the requirements to support CIP Safety are now defined for products implementing the Sercos III protocol.